SciELO - Scientific Electronic Library Online

 
vol.18 issue24INFLUENCE OF (pH) ON THE ADSORPTION PROCESS OF Pb2+ IN ZEOLITE TYPE MATERIALSANALYSIS OF ELECTROMECHANICAL FAILURES IN PYROTUBULAR BOILERS author indexsubject indexarticles search
Home Pagealphabetic serial listing  

Services on Demand

Article

Indicators

    Related links

    • Have no cited articlesCited by SciELO
    • Have no similar articlesSimilars in SciELO

    Bookmark

    Revista Tecnológica

    Print version ISSN 1729-7532

    Abstract

    FLORES MONRROY, Javier Marcelo. EQUIPMENT VIBRATOR -THERMAL FOR TO SEPARATE ELECTRONIC COMPONENTS FROM PLATES SUPPORTED IN DISUSE (Design, construction and testing). Rev. Tecnológica [online]. 2022, vol.18, n.24, pp. 14-16. ISSN 1729-7532.

    ABSTRACT In special the abundant and highly diversified electronic, devices today, once they have completed their life cycle or due to obsolescence. As they contain circuit support boards that group minor electronic components, almost always in good condition, for example, TTL and CMOS integrated circuits, microprocessors, coils, transformers, capacitors or ceramic capacitors (polyester and tantalum), low power transistors, connectors, heat sinks, electronic timers and others. They can become a potential source that provides and reuses these components, for the teaching-learning practices of digital and analog electronics, in addition to using some of these components in repairs of other electronic equipment. However, the removal and withdrawal of these components from the support plates requires great care so as not to damage the numerous small terminals that these electronics components have. Reason for which, in this work. Is proposed to converter this concern into the design and construction, of a equipment capable of removing and separating these components without causing their damage and uselessness, through a mechanical assembly that fixes and supports the vertical plate, while increasing the temperature in the tin solder parts until total melting, at which point an vibration and impact mechanism (blow) is activated that separated and makes the electronic components fall from the support plate for their subsequent classification and reuse.

    Keywords : Minor electronic components included in support boards (circuits; tin fusion; Thermal and impact equipment.

            · abstract in spanish | portuguese     · text in spanish     · pdf in spanish